The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.
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Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. Our target is to completely satisfy customer demands even on the most complex projects. Our technologies have set international standards for true innovation. Since we place great importance on continually expanding our know-how, we are diligent about keeping up with the latest research.
The company has grown since then to more than employees today. In its strategic alignment 3D-Micromac concentrates particularly on international and high-growth, high-tech markets.
We are one of the first companies in the world to focus on the use of ultra-short pulse lasers for the processing of materials. We also specialize in the use of excimer lasers for microprocessing. More than excimer laser systems produced by 3D-Micromac AG are currently in industrial use.
microDICE – Laser Micromachining – 3D-Micromac AG
From the founding of our company until today we have constantly been able to achieve important milestones:. In a period of 10 years 3D-Micromac AG has carved out a strong position for itself among manufacturers of laser micro-processing systems. With that we have established a strong foundation for dynamic growth in international markets. More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.
Target of this project is to explore and to develop new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications. The four major European semiconductor and system suppliers Infineon, STMicroelectronics, Bosch and Thales will collaborate with eleven equipment and analytical method suppliers from Germany and France.
The work is supported by five academic institute partners.
This collaboration will strengthen the competitiveness of the semiconductor and system suppliers to design innovative MtM and SiP products in respect to reliability, quality, cost and shorter time to market to ensure leadership in a global perspective. The project will also support European analytical equipment providers, many of them SME, to explore new market opportunities, design new equipment, and to align their developments to future needs of new system integration technologies.
This project has received funding from the Federal Ministry of Education and Research under grant agreement no [16ES]. A main aspect in technological developments for photovoltaics is the reduction of cost per power of the solar panel. Through dividing the solar cells in half cells before integrating in modules electrical losses can be reduced. Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules.
The main goal is to separate the cells without inducing damage at the cutting edge. The electrical and mechanical properties of the cells after cutting are in the focus of the investigations. Those properties should be unchanged after cutting. Therefore TLS is a promising approach as TLS dicing works without remove of material and create a smooth cut nearly without deterioration. This should lead to an increased lifetime of the solar modules.
Thereto the project part of 3D-Micromac will provide an important contribution: Approaches for the further substantial increase of the throughput should be developed with respect to the equipment. All components have to be adapted to the requirements of the new high efficiency laser processes. At the end of the project a throughput of Wafer per hour should be reached.
Firstly the developments are oriented to the state of the art. Approaches for precise local laser doping based on lean equipment concepts should be developed as well as a process based on a cost efficient infrared laser source. This opens up a huge variety of possibilities and niche applications for BIPV. These platforms are open to multiple users and for multiple applications. The project aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates.
The focus here is on thin glass, which offers advantages over plastic as a substrate due to its outstanding barrier properties. For the production in the roll-to-roll process, the winding processes of the thin glass substrate must first be integrated to the coating unit.
As a further challenge, laser cutting and structuring processes are developed for substrate separation and interconnection.
In addition work will directed to efficient protective coatings for the OLEDs as well as to transparent electrical contacts which give added value to the lighting market. As a result of the project, demonstrators are being developed that illustrate the power of the technology. Some of the technologies are being researched in cooperation with cooperation partners from the partner cluster in Yonezawa, Japan.
With the provision of the technology for crack-free separation of thin glass laminates, the 3D-Micromac AG is an important partner in the project. For the past 16 years, the name 3D-Micromac AG stands for highest quality and satisfied customers.
Therefore, we are very proud to be certified to the ISO quality standard since The certification covers the entire spectrum of development, production, sales and service of our machines, plants and technologies.
With this certification, we prove our successful quality management and the efficiency of our process chains as well as our efforts to a continuous improvement.
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